Applications

Examples of applicatons, which are enabled or specially supported by the outstanding characteristics of INNOSLAB are exemplarily listed below.

Scientific applications

Pumping of dye-lasers with high repetition rate in the range of kHz

Datasheet
of the dye-lasers of SIRAH, pumped by an INNOSLAB-Laser

Removal of thin-film layers on solar-cells

Manufacturing of solar-cells:
Creation of an isolation rim by use of laser ablation of the thin-films of a solar cell

Thin-film structuring

Structuring of thin-films on a monocrystalline Si-solar cell

Drilling of glass

The picture shows a glass cube, in which a precise hole has been manufactured with a q-switched INNOSLAB-laser. The particular advantage of this process is, that the cross-section of the hole can be varied along the hole depth and almost any aspect ratio can be choosen for the hole.

The hole in the enlarged picture has a quadratic cross-section with 1 mm edge width and a conical extension in the middle with a circular cross-section.

The horizontal hole in the picture has a diameter of 0,6 mm, even 0,1 mm in 4 mm thick glass has been demonstrated.

(For better visualisation the holes have been filled with colored liquid)

Sub-surface engraving of transparent materials

The right-hand side picture has been engraved into the bulk of a glas sheet. With INNOSLAB-lasers this engraving can be performed at speeds more than 20 times higher and accuracies more than 2 times better than with conventional lasers. Thus the productivity of the process can be increased considerably, for instance for the engraving of large pieces of flat sheet glass.

Cutting of sheet glass

With a q-switched INNOSLAB-laser high speed cutting of sheet glass can be easily performed by introducing tiny cracks below the surface of the glass. The sheet can be separated easily after this process.

The picture shows sheet glass of 4 mm thickness, having been cut with approx. 2 m/s. The process can be scaled to very thick glasses.

Apart form this scratching process the glass can be cut by a removal process similar to the drilling of glass, however with slower speed.

Drilling of saphire

The picture shows a hole in 1 mm thick saphire, which has been drilled with a pulsed INNOSLAB-laser. The pulse power was 300 W, the pulse length 0,2 ms and the repetition rate was war 1 kHz.

Surface smoothening

The short pulse length in combination with the high pulse repetion rates of INNOSLAB makes it possible to smoothen surfaces of metal parts, moulds for instance, so that the surface roughness can be considerably decreased without any mechanical tools. The right hand side picture shows a test sample, which has polished with an INNOSLAB-laser to a roughness of ra=0,2 micrometer; with conventional lasers only 2 micrometer can be achieved.

(courtesy of Fraunhofer-Institute for Laser Technology)

Removal/Engraving of metals

Engraving in copper and mild steel: the typical depth of the structures ammounts to 0,5 mm. An INNOSLAB laser has been used with an averadges power of approx. 10 W and a repetition rate of 30 kHz.

(In cooperation with Fraunhofer-Institut for Laser Technology, Aachen)

Drilling of metals

Trepanning of a stainless-steel sheet with an INNOSLAB IS-laser: the averadge power during this trepanning process was 15 W, the pulse repetion rate was 12 kHz.

(In cooperation with Fraunhofer-Institut for Laser Technology, Aachen)

Rapid product manufacturing

With the so-called technology of "selective laser powder remelting" (SLPM) 3-dimensional functional prototypes can be manufactured based solely on metal powder and CAD-data of the component. Since the INNOSLAB-laser combines high outpit power with high beam quality and thus can be focused on spot sizes considerably smaller than conventional lasers the accuracy and speed of SLPM-processes can be increased considerably.

(courtesy of Fraunhofer-Institute for Laser Technology)

Futher examples of applications

  • marking,
  • precision cutting, welding and drilling,
  • cleaning,
  • Investigation of chemical and flow processes with the particle-imaging-Velocimetry (PIV)
  • Pumping of Ti:Saphire- and Dye-lasers
  • Pumping of optic-parametric oszillators (OPO)