INNOSLAB
Innovative Technology for New Tasks

The outstanding new feature of INNOSLAB technology is its ability to drill fine channels with an aspect ratio of more than 300:1 and create hollow cavities in glass, and to cut glass. In order to produce accurate hollow structures in glass, the laser beam is directed at the workpiece from behind and focused on the opposite surface, allowing the evaporated material to escape freely. The INNOSLAB process is contactless and noiseless.

An other outstanding advantage of the INNOSLAB-technology is the high repetition rate, qualifiying the laser for non-linear optical set-ups such as OPO´s and Ti:Saphire-lasers which are able to achieve high temporal resolutions.

• precise, reproducible drill holes of any cross-section
• variable cross-sections, e.g. conical
• scaleable drilling depth with no loss of accuracy
• three-dimensional structures
• high-speed scratching and cutting, even curved contours

Pumping of dye lasers, OPO´s, OPG´s and of Ti:Saphire-lasers

High-speed-LIF with a dye-laser, which is pumped by an INNOSLAB-laser; example: flame of a Bunsen-burner.

• Electronics industry, e.g. drilling fine holes in printed circuit boards
• Automobile industry, e.g. the manufacture of fuel injection valves
• Toolmaking and mechanical engineering, e.g. 3D structuring
• Medical engineering, e.g. rapid product manufacturing
• Analytical tools, e.g. the fabrication of microreactors
• Decorative design, e.g. 3D engraving of luxury gift items
• Cabinet making, e.g. the cutting and sub-surface engraving of sheet glass
• Construction industry, e.g. application of a non-slip finish to polished flooring